Component package type
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Library attribute
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Attribute Details
From Library
Type: List
The physical package in which the electronic component is supplied, such as SOIC, QFN or BGA. Use the manufacturer's package designation and preserve suffixes that identify a different size or lead arrangement. It helps check board and assembly compatibility; shipping packaging is not the component package.
- Type
- List
- Group
- Component case and mounting
- Range of values
- Single value from
- List values
- DIP SOIC SOP SSOP TSSOP QFN DFN QFP LQFP TQFP BGA LGA CSP WLCSP SOT TO Axial Radial Chip Module Bare die
- Units of measurement
- Not applicable